Abstract
A new film fabrication method for metallic alloy has been established using coaxial vacuum arc deposition (CVAD). In our vacuum arc system, because the plasma on the surface of the evaporation source (target) can be controlled by pulsed arc discharge, it is possible to fabricate the films with same compositions as the target and to control the thickness of the Ti-Al film at a nanometer scale. In this report, crystallographic results of the Ti-Al films resulting from changing the substrate and after the heat-treatment is demonstrated.
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