Abstract
Abstract We review the surface chemistry and kinetics relevant to the chemical vapor deposition (CVD) of metals used for microelectronic applications. Our efforts focus on the surface chemistry of aluminum, tungsten, and copper CVD, which have received the most recent interest for metallization. We first briefly review a variety of topics concerning the applications and the chemistry and kinetics of metal CVD. We also give a brief overview of the application of surface science techniques to the study of CVD-related surface chemistry.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Critical Reviews in Solid State and Materials Sciences
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
