Metal Containing Link Formed in Amorphous Silicon Metal-To-Metal Antifuse

Abstract

AbstractA Metal-to-Metal (M2M) antifuse is formed using hydrogenated amorphous silicon as a dielectric material between two refractory metal electrodes. The M2M antifuse is used as a programmable device in an FPGA, where it is placed between two interconnect metal layers of a Logic CMOS process. The M2M device may then be programmed to interconnect logic circuits. The resulting programmed link is an alloy of amorphous silicon and barrier metal that forms a low resistance path between the logic circuits.