MEMS devices for the future wireless applications

Abstract

In this communication, we will outline the potentialities offered by the MEMS technologies to realize front end modules featuring attractive performances in term of noise, linearity, power consumption and compactness. Bulk micromachining techniques are used to achieve very low loss interconnects up to millimeterwave range when surface micromachining techniques are preferred to realize moveable devices. The association of bulk and surface micromachining allows to realize advanced millimeterwave microsystems. Concerning the design methods, both electromagnetic, electrical and mechanical simulation are mandatory to get accurate results.