Abstract
Two new electrical contact materials, carbon nanotube (CNT) and carbon nanofiber (CNF), Cu-matrix composite films are prepared by composite electroplating. The microstructure, morphology and physical performance of Cu–CNT/CNF composite films were analyzed by a scanning electron microscope, a Vickers hardness tester and a semiconductor parameter analyzer. The scanning electron microscope images showed that the CNTs/CNFs were dispersed uniformly and combined well in the Cu matrix. Furthermore, the Cu–CNT/CNF composite films show relatively good physical properties, for example the hardnesses of Cu/CNT and Cu/CNF composite films are 156 HV and 207 HV, about 13.9% and 51.1% higher than that of the pure copper plating film (137 HV); the resistivities of CNT/CNF composite plating films are 2.656 × 10−6 Ω cm and 1.815 × 10−6 Ω cm, lower than those of other Cu-matrix composites such as CuW, 4.35 × 10−6 Ω cm, and CuMo, 3.571 × 10−6 Ω cm. In addition, CNT and CNF Cu micro special electric contacts have been designed and successfully fabricated by MEMS technology. The arc-erosion behavior of Cu/CNT and Cu/CNF contacts has been examined on an electric arc-erosion apparatus. The test result shows that the arc-erosion losses of Cu/CNT and Cu/CNF contacts are 2.7 mg and 3.0 mg, 22.9% and 14.3% lower than that of pure Cu (3.5 mg) under the same condition.
Published Version
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