Abstract

MEMS (micro electro mechanical systems) are tiny mechanical structures in the micrometer range combined with an ASIC (application specific integrated circuit). MEMS at Bosch look back on more than 25 years of development and production and started based on KOH wet‐etching with restrictions in geometry due to the crystal‐oriented etch behavior of KOH. Based on several years of experience in plasma processing and the availability of new prototype plasma sources, the “Bosch Process,” a three‐dimensional plasma etch process for silicon was invented. This is the key enabler for today's huge variety of MEMS products in our every day life.

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