Abstract
Detailed investigation of Ohmic Cr/Ni/Au based contact formation to p-GaN was realized by scanning transmission electron microscopy and energy-dispersive x-ray spectroscopy and compared to the Cr/Au bilayer metallization scheme. The authors found that it is essential to introduce a nickel film in Cr-based contacts and anneal the trilayer structure in air in order to suppress the Shottky barrier and thus obtain the Ohmic contact. Our findings also indicate that oxygen behaves as a dopant dispersed in chromium nitride matrix. Thus Ohmic trilayer Cr/Ni/Au contact to p-GaN annealed in air is formed by Ni–Ga–Au alloy mixed with Au–Ga-doped Cr2N crystalline composites. Possible ways for improvement of such types of contact are discussed.
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