Abstract
Photoresist lithography has been applied in MEMS (micro electro mechanical systems). A flexible 3D (three-dimensional) micro/nano fabrication technique and its process simulation tool are required for 3D MEMS. This paper presents an UV (ultraviolet) lithography process simulation for the formation of an embedded micro/nano fluidic channel in a negative-tone photoresist. For this purpose, the moving-mask technology is modeled. The simulation algorithm of the nanolithography is applied for the micro-lithography. The validity of the simulation for the proposed 3D microstructuring is successfully confirmed by a comparison between the experimental and the simulated results. Hence, modeling and simulation for the formation of various patterns of micro/nano fluidic channels in a negative-tone photoresist can be used to provide the photoresist characteristics and to optimize the lithography process conditions.
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