Abstract
This paper reports a melt blend of poly(lactic acid) (PLA)/ethylene-butyl acrylate copolymer (EBAC) with organoclay content at 3 phr. The mechanical, thermal and morphological properties of PLA/EBAC blends and nanocomposites were investigated. The morphological analysis revealed EBAC phase dispersed as a spherical domain in PLA matrix and the domain size of EBAC dispersed phase increased with increasing EBAC content. The addition of organoclay could improve the miscibility of PLA/EBAC blends due to the decrease of domain size of EBAC dispersed phase. The mechanical properties indicated that the strain at break and impact strength of PLA increased when added EBAC, but Young’s modulus and tensile strength decreased. Storage modulus increased with the addition of organoclay to the PLA/EBAC blends. The thermal properties found that the incorporation of organoclay in the PLA/EBAC blends did not effect on the glass transition temperature and melting temperature values relative to PLA. The degradation temperature of PLA improved with the addition of EBAC. This indicated that EBAC has more thermal stability and degradation temperature than PLA. From X-ray diffraction patterns displayed the characteristic peak in PLA/EBAC/organoclay nanocomposites appeared at the lower angle, which indicated the dispersed clay is intercalated in the polymer matrix. However, second-order diffraction peak appeared at the higher angle indicated that there was partially the conventional composite.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.