Mechanical simulation and debonding risk analysis of OLED panels with optically clear adhesives

Abstract

This paper presents a mechanical simulation model and analysis method for OLED panels. The functional layers within the panel are bonded using optically clear adhesives (OCAs), which are pressure-sensitive adhesives (PSAs), resulting in a soft interface bonding problem. It was discovered that the normal tensile debonding strength of OCAs was significantly lower than the shear debonding strength. To address this issue, a three-layer structure simulation model of “hard + soft + hard” is established, which allows for analyzing the screen folding problem of any radius. Additionally, a suitable element mesh generation strategy for multi-layer structure screens is proposed. A debonding risk index based on pressure is introduced by comparing the interlaminar normal and maximum principal stress. The influence of thickness, bending radius, and Young’s modulus on longitudinal stress and debonding risk index is examined. It is observed that the influence of thickness and Young’s modulus on debonding risk is non-monotonic, indicating the presence of an optimal solution. The high debonding risk area is located at the beginning of the folding mechanism and screen bonding. The proposed debonding risk index is not only applicable to OCAs but also to all PSA with similar structures.