Abstract

The aim of the article was to determine the compressive strength and compressive strain of an unmodified and a modified epoxy compounds containing a montmorillonite filler, as well as to determine the effect of temperature and an aging time on the mechanical parameters of the considered epoxy compounds. The subject of the research was both the unmodified and the modified adhesive compounds. The unmodified epoxy compounds were made in four variants, which included the epoxy resins based on a bisphenol A as well as the curing agents: a triethylenetetramine and a polyamide curing agent. The modified compounds containing the montmorillonite filler, were also made in four variants. The samples were subjected in a thermal chamber at 80 °C for 1 and 2 months and in a thermal shock chamber in the temperature range from − 40 °C to 80 °C for 1 and 2 months. The reference samples were seasoned at room temperature 20–25 °C. The epoxy compounds samples were subjected to the compression strength tests in accordance with ISO 604 standard. The compressive strength is influenced by the environment and temperature, the aging time and the presence of the modifying agent. The epoxy compounds subjected at elevated or variable temperatures have higher compressive strength than the reference epoxy compounds. The operation of the climatic chamber or the thermal shock chamber makes the samples more deformable than the reference samples.

Highlights

  • The epoxy resins were introduced as industrial products more than 70 years ago

  • Eight types of the epoxy compounds were prepared for the tests, made of two types of the epoxy resins based on the bisphenol A resins (Epidian 5 and Epidian 57 trade name, CIECH Resins, Nowa Sarzyna, Poland) and two types of the curing agents: a polyaminoamide curing agent (PAC trade name, CIECH Resins, Nowa Sarzyna, Poland) and a triethylenetetramine curing agent (Z-1 trade name, CIECH Resins, Nowa Sarzyna, Poland) and montmorillonite filler (NanoBent ZR2 trade name, ZGM “Zębiec” S.A., Zębiec, Poland)

  • In each case of operating conditions (Fig. 3 and Figs. 4, 7, and Fig. 8) of the epoxy compounds containing in their composition the base resin unmodified (Epidian 5), the compressive strength is higher for the epoxy compounds containing the amine curing agent

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Summary

Introduction

The epoxy resins were introduced as industrial products more than 70 years ago. They immediately aroused a great interest due to the valuable properties that distinguish them from other plastics. They found the application in various fields of a technology, especially in electronics and an electrical engineering. Due to their extremely favourable properties and relatively simple processing methods, the epoxy resins are increasingly used in the industry [1]. During the curing of the resin, slight shrinkage occurs and the castings accurately follow the shape of the mould, making it possible to obtain them without exerting

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