Abstract

AbstractSilicon carbide fiber–reinforced silicon carbide (SiCf/SiC) composites have been expected to be used as next‐generation heat resistant structural materials with high reliability. The fiber/matrix interface for SiCf/SiC composites plays an important role for toughening and strengthening, and it is important to form the optimal interphase for SiCf/SiC composites. In this study, hexagonal‐boron nitride (h‐BN), which shows better oxidation resistance than carbon, was selected as the interphase for SiCf/SiC composites, and h‐BN coating was formed on low‐conductive SiC fibers by the electrophoretic deposition (EPD) method using flaked h‐BN suspension prepared by wet‐jet milling. Unidirectional SiCf/SiC composites with the BN interphase formed by the EPD method were prepared by polymer impregnation and pyrolysis (PIP) method, and their mechanical properties were evaluated. The uniform h‐BN interphase was successfully formed on the low‐conductive SiC fibers by EPD when thin polypyrrole (Ppy) coating, that is, conductive polymer, was formed on the SiC fibers. The h‐BN coating became denser by heat‐treatment at 1000°C, and the h‐BN coating deposited tightly on the SiC fibers was confirmed. It was demonstrated that the SiCf/SiC composites with the uniform and relatively dense h‐BN interphase formed by EPD using flaked h‐BN particles exhibited pseudo‐ductile fracture behavior with large amount of fiber pullout and higher fracture energy.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.