Mechanical characterization of copper-MWCNT epoxy matrix polymer composite

Abstract

Due to their ability to self-heating, copper (Cu) and multiwalled carbon nanotubes (MWCNTs) are suggested for thermal interface applications such integrated circuits, electronics, and micro heat exchangers. Volumetric concentrations of 0.5 wt% and 1.0 wt% MWCNTs, as well as 2.0 wt% and 4.0 wt% Cu particles are packed with a resin-balanced epoxy composite created (Specimens: MCE1 and MCE2). The experimental setup and plate dimensions are prepared according to ASTM charts. The ultimate tensile strength, flexural strength, and hardness of MCE2 are 23.45 MPa, 52.43 MPa, and Shore-D 92. The impact strength is 5% higher than MCE1 (32.5 J/m), which makes it slightly different from MCE1. The results are furthermore evaluated by Scanning electron microscopy for morphological testing. The SEM images are highly revealed that the dispersion of the copper particles at 4.0 wt% composite and ultra-fine filler (MWCNT) dispersion for both samples. Since they are tightly aggregated in their respective zones, the majority of the particles are stacked towards the bottom, even with the addition of 1.0 wt% MWCNT and 4 wt% Cu to the epoxy-based composite resulted in mechanical properties retardation.