Abstract
Aromatic silicon-containing poly(amide-imide)s have been prepared by low temperature solution polycondensation reaction of various aromatic diamines having ether bridges between phenylene rings with a diacid chloride, namely bis[N-(4-chlorocarbonylphenyl) phthalimidyl]dimethylsilane. These polymers were easily soluble in polar amidic solvents such as N-methylpyrrolidone,N,N-dimethylacetamide, and N,N-dimethylformamide and can be cast from solutions into thin, flexible films. They showed good thermal stability, with initial decomposition temperature being above 410°C and glass transition temperature in the range of 263–285°C. The polymer films exhibited good mechanical properties with tensile strengths in the range of 78–109 MPa, tensile modulus in the range of 1.44–1.76 GPa, and elongation at break values ranging from 11% to 24%. Electrical insulating properties of two polymer films were evaluated on the basis of dielectric constant and dielectric loss and their variation with frequency and temperature.
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