New Poly(Imide‐Ether‐Amide)s Based on Epiclon

Abstract

Epiclon, 5‐(2,5‐dioxotetrahydrofurfuryl)‐3‐methyl‐3‐cyclohexenyl‐1,2‐dicarboxylic acid anhydride, reacted with p‐aminobenzoic acid to give a dicarboxylic acid containing imide rings. This was further treated with thionyl chloride to give the corresponding diacid chloride having epiclon units and imide rings. New poly(imide‐ether‐amide)s have been synthesized by a solution polycondensation reaction of this diacid chloride with various aromatic diamines having ether bridges between phenylene rings. These polymers are easily soluble in polar amidic solvents such as N‐methylpyrrolidinone or dimethylformamide and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 350°C and glass transition temperature in the range of 223°C–238°C.