Abstract
Films with thickness ranging from 10 to 100 μm are increasingly being used as the structural components of microelectromechanical systems (MEMS). Measuring the mechanical properties of these thick films is essential for enabling the design of MEMS with high performance and sufficient reliability. In this paper, we present a simple and convenient method for measuring the elastic modulus of thick films by loading a clamped circular film using a spherical tip. The test is implemented using a commercial nanoindenter so that the load and displacement can be measured with resolution of micronewtons and nanometers, respectively. Robust protocols have been developed for implementing the test within the constraints imposed by the nanoindenter. A crucial component of these protocols is a method for selecting loads to ensure deformation in the elastic bending regime and to minimize the relative contribution of contact indentation. The accuracy and utility of the nanoindenter-based bending test are discussed using measurements on thick films of aluminum and a standard epoxy.
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