Abstract
Signal or power to ground traces on a printed circuit board (PCB) of digital products may act as an efficient loop antenna radiating magnetic field when the length is greater than the wavelength of the high frequency current. Employment of proper routing of the return current path, filtering and damping resistor is best practices in the design criteria to minimise sources of electromagnetic emission at PCB level. It is important to indicate that the use of guard traces, filtering at supply network of critical component and damping resistor on signal traces can be the options of emission reduction techniques on double sided assemblies as it will reduce the emission level. In this paper, three double sided test boards are developed to evaluate the impact of the aforementioned mitigation methods on near magnetic field emission. The magnetic field distributions over each layout are measured in order to reveal the profile of radiation to gain further understanding on the net current distribution on the traces of the digital circuit. It is seen that by proper design of return current path, the magnetic field is reduced by average of 16.5 dB.
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