Abstract

Low-field electron and hole effective mobilities ( μ eff) of ultra-thin SOI n- and p-MOSFETs, down to a silicon thickness T Si of approximately 5 nm, have been measured at different temperatures using a special test structure able to circumvent parasitic resistance effects. At large inversion densities ( N inv), ultra-thin SOI exhibit higher mobility than heavily doped bulk MOS and a weak dependence of mobility on silicon thickness. However, at small N inv the mobility is clearly reduced for decreasing T Si, due to enhanced phonon scattering in the thin quantum well.

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