Measurement of Line Distribution of Thermal Contact Resistance Using Microscopic Lock-In Thermography

Takuya Ishizaki,Hosei Nagano,Ai Ueno

doi:10.3390/engproc2021008018

Abstract

This paper proposes a new thermal contact resistance measurement method using lock-in thermography. Using the lock-in thermography with an infrared microscope, the local temperature behavior in the frequency domain across the contact interface was visualized in microscale. Additionally, a new thermal contact resistance measurement principle was constructed considering the superimposition of the reflected and transmitted temperature wave at the boundary and taking into account the intensity distribution of the heating laser as the gaussian distribution, and the specific geometrical condition of the laminated plate sample. As a result of the experiments, the one-dimensional distribution of the thermal contact resistance was obtained along the contact interface from the analysis of the phase lag.

Highlights

Thermal contact resistance (TCR) is a phenomenon where heat flow is impeded at the contact interface between two materials
To understand TCR, we evaluated its factors and measured the local TCR
The steady state method, which is generally used in this case, was used to measure the averaged TCR value across the contact interface of a bulk sample

Summary

Introduction

Thermal contact resistance (TCR) is a phenomenon where heat flow is impeded at the contact interface between two materials. The steady state method, which is generally used in this case, was used to measure the averaged TCR value across the contact interface of a bulk sample. A method to measure local TCR in the contact interface has not yet been established.

Results

Conclusion