Abstract
In this paper, in order to ensure its performance in practical applications, the mechanical and electromechanical properties of thick-film evaporation-in-dual chamber (EDDC)-SmBCO coated conductor (CC) tapes with high critical current have been investigated. The effect of CC tape architecture and film thickness on critical current Ic in EDDC-SmBCO CC tapes with thick film under uniaxial tension and bending deformation was measured and compared with the Cu-stabilized sample. By adopting a bridge pattern and by applying a magnetic field and some measures, the electromechanical property of thick-film CC tapes with high Ic could be evaluated, suppressing the burnout during deformation. As a result, increasing the SmBCO film thickness affects the irreversible strain limit and Ic degradation behaviors. In the case of a 5- μm-thick film, an acceptable bending strain tolerance 0.34% was measured and the uniaxial irreversible strain limit of 0.28% can be still improved by an additional Cu stabilizer.
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