Abstract
Laminated HTS coated conductor (CC) tapes having a unique multi-layer structure made them vulnerable when exposed to transverse loading. Electromechanical transport properties of these CC tapes can be affected by excessive transverse stresses. Due to the coefficient of thermal expansion (CTE) mismatch and incompatibility among constituent materials used in coil applications, delamination among layers occurs and causes critical current, Ic degradation in the CC tapes. In this study, the delamination behaviors in copper (Cu) solder-laminated CC tapes by soldering and surround Cu-stabilized ones by electroplating under transverse tension loading were investigated. Similarly to the surround Cu-stabilized CC tapes in our previous reports, the Cu solder-laminated CC tapes also showed an abrupt and gradual Ic degradation behavior. However, the Cu solder-laminated CC tapes showed different delamination morphologies as compared to the surround Cu-stabilized CC tapes; the superconducting side and the substrate side of the Cu solder laminated CC tapes were totally separated by delamination. On the other hand, the brass laminate did not show any significant effect on the delamination strength when it is added upon the surround Cu-stabilized CC tapes.
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