Measurement Methodology for Accurate Modeling of SiC MOSFET Switching Behavior Over Wide Voltage and Current Ranges

Abstract

This paper presents two novel measurement methods to characterize silicon carbide (SiC) MOSFET devices. The resulting data are utilized to significantly improve the extraction of a custom device model that can now accurately reproduce device switching behavior. First, we consider the $I_{\text{d}}- V_{\text{ds}}$ output characteristics of power devices such as SiC transistors. These are typically measured using traditional curve tracers, but the characterization of the high-voltage and high-current (HVHC) region is very challenging because of device power compliance and self-heating. In this paper, we introduce a measurement technique that overcomes self-heating and derives the HVHC region from switching waveforms. The switching transient characteristics of devices are used to determine drain current $(I_{\text{d}})$ as a function of drain–source voltage $(V_{\text{ds}})$ in the HVHC range. Second, we consider another challenging characterization area: measurement of nonlinear capacitances when device is turned on. These capacitance characteristics of on-state devices are important for correcting disagreements between simulations and measurements in turn-off switching transient waveforms and cannot be measured using a conventional capacitance-voltage meter. We introduce S-parameter measurements as an effective method to obtain the capacitance characteristics of both off-state devices and on-state devices. These novel measurement techniques have been applied to the modeling of a SiC device. The extracted device model, a modified version of the popular Angelov−GaN high-electron-mobility transistor model, shows significant improvement in terms of the accuracy of switching waveforms of devices over a wide range of operating conditions.