Abstract
The demand for Multichip Modules (MCMs), is rapidly growing. The cost-effective production of prototype MCMs within a tight time schedule is hindered by the difficulty experienced with the procurement of Known Good Die (KGD) in small quantities-indeed even the procurement of untested silicon devices in prototype quantities is problematic. This paper describes a method suitable for the manufacture of prototype MCMs using die recovered from ceramic packages. Such a technique was developed and proven during the manufacture of a prototype MCM using the FODEL (Du-Pont) photoprintable thick film process and memory devices recovered from DIL Ceramic packages. After approval of the performance of the prototype MCM, very few or no changes will need to be implemented. The silicon devices can then be procured in production quantities as KGD and substrate manufacture can commence.
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