Abstract
We propose the newly developed contact scheme for high performance DUT (Device Under Test) interface, so called, HiPEC (High Performance Elastic Connection). The HiPEC consists of Ni based micro- bumps with Cu line-pattern on P-PTFE (Porous Poly Tetra Fluoro Ethylene) membrane, supported by silicon rubber elastoma. The metal contact via micro-bump makes a reliable contact by scratching action, generated by shape transformation of elastoma under small force. The P-PTFE membrane is usable beyond 10 GHz high frequency signal transmission, and has excellent high isolation characteristics with less than sub-pA leakage current. The HiPEC technology is useful for high pin count DUT interface with high performance, replacing contact-pin, and also for die chip contact to enable KGD (Known- Good Die) test of mixed signals MCM (Multi Chip Module).
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