Abstract
The possibility of compliance with the required technological soldering conditions and ensuring their reproducibility for wave soldering, laser soldering, convection soldering have been researched. Comparing the experimental data to the results of mathematical modeling allowed selectng optimal modes of the wave, convection and laser soldering of electronic devices. The conclusion about the prospects of the analytical dependencies to improve mechanical soldering of electronic devices for any purpose. When heating by convection or wave solder, the temperature along the depth of the solder joints is less than when the contact or laser soldering. It was found that the temperature of the solder joints with infrared and laser soldering can be estimated based on the heat equation for a semi-infinite plate with a given heat flow on the surface. Warming up of the printing unit and, consequently, the solder joints when soldering, convection can be described by equations of the regular mode.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
