Abstract
The influence of tool rake angle and cutting speed on the ultra-precision cutting of single crystal silicon with natural single crystal diamond tools is studied by experiment and molecular dynamics (MD) simulations. The findings demonstrate that the 0° rake angle tool attains superior surface quality, reduced cutting force and friction coefficient in comparison to the −10° and − 20° rake angle tools. Moreover, the MD results reveal that a smaller negative rake angle tool can decrease the formation of high pressure phase atoms and other defects. In addition, the PV, RMS and Ra surface roughness parameters decrease as the machine spindle speed increases. Additionally, higher cutting speeds improve the surface morphology of the machined workpiece and produce fewer defective atoms.
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