Abstract
The way how non-metallic materials are modified by electronic excitation is reviewed. It is emphasized that material modification involves bond scission, for which localization of single or multi-holes to reduce the bonding strength and localization of electronic excitation energy to cause alternations of local atomic structures are needed. The conditions that the bond scission is induced in semiconductors and insulators are surveyed. A few examples of reactions in several types of materials are presented.
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