Abstract
Material design aspects of high density interconnects in multichip modules (MCMs) generally concentrate on processing and bonding compatibility, maximum yield and cost effectiveness. Reliability and failure analysis investigations focus mainly on bonding and chip level problems. Only a few studies have dealt with reliability problems arising from the interconnection substrates themselves, and even less work has been devoted to obtaining feedback for the material design. However, the new or repeatedly ‘discovered’ material systems in MCMs need more detailed discussion. This paper concentrates on the material selection problem in order to minimize short circuit failure formation possibilities for various MCM interconnection substrates, chip bonding and packaging types, considering also processing compatibility and cost aspects as well.
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