Abstract

In the course of the last few years, new component package types and high density interconnect (HDI) substrate technologies have emerged and presented new challenges to manufacturers. New package types include a great variety from flip chips (FCs), through quad flat packs (QFPs), to micro ball grid arrays (micro-BGAs) and chip scale packages (CSPs), while for substrates, laminated or build-up HDI technologies are preferred. In particular, laser via generation and patterning technology provided new possibilities in the field of the fabrication of laminate substrates for multichip modules (MCM-Ls). Since the application of a new technology always brings new degradation and failure mechanisms, reliability testing and failure analysis are necessary to maintain the quality of products and parts.

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