Abstract
In the course of the last few years, new component package types and high density interconnect (HDI) substrate technologies have emerged and presented new challenges to manufacturers. New package types include a great variety from flip chips (FCs), through quad flat packs (QFPs), to micro ball grid arrays (micro-BGAs) and chip scale packages (CSPs), while for substrates, laminated or build-up HDI technologies are preferred. In particular, laser via generation and patterning technology provided new possibilities in the field of the fabrication of laminate substrates for multichip modules (MCM-Ls). Since the application of a new technology always brings new degradation and failure mechanisms, reliability testing and failure analysis are necessary to maintain the quality of products and parts.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
