Material and design considerations of FBGA reliability performance

Abstract

FBGA package reliability is usually assessed through the conventional approaches of die attach and mold compound material optimization. However, with the rapid changes and fast-moving pace of electronic packaging and the introduction of new soldermask and core materials, substrate design has also become a critical factor in determining overall package reliability. The purpose of this paper is to understand the impact design and soldermask material of a rigid substrate on overall package reliability. Three different soldermask patterns with a matrix of different die attach, mold compound, and soldermask materials are assessed using the moisture sensitivity test (MST). Package reliability is also assessed through the use of temperature cycling (T/C) at conditions “B” and “C.” For material optimization, three different mold compounds and die attach materials are used. Material adhesion between different die attach materials and soldermask materials are obtained through die shear performed at various temperatures and preset moisture conditions. A study correlating the different packaging material properties and their relative adhesion strengths with overall package reliability in terms of both MST and T/C performance was performed. Soldermask design under the die pads was found to affect package reliability. For example, locating vias at the edge of the die is not desirable because the vias acts as initiation point for delamination and moisture-induced failure. Through die shear testing, soldermask B demonstrated higher adhesion properties compared to soldermask A across several packaging materials and enhanced the overall package reliability in terms of both MST and T/C performance. Both MST JEDEC level 1 and the T/C of “B” and “C” at 1000 cycles have been achieved through design and package material optimization.