Effects of hygrothermal ageing and thermal shock on reliability of interfacial adhesion between black oxide coated copper substrate and epoxy resin

Abstract

Black oxide is a conversion coating applied onto the Cu substrate to improve the interfacial adhesion with polymeric adhesives. A comprehensive study was made to characterize the black oxide coating and the corresponding interfacial adhesion with various types of polymeric resin, aiming to optimize the oxide processing conditions. The reliability of adhesion performance of the coating was evaluated before and after accelerated hygrothermal ageing, such as temperature cycling, pressure cooker test, and moisture sensitivity test followed by thermal shock. The moisture resistance of the substrate with black oxide coating was much higher than the bare Cu substrate, during both the moisture absorption and desorption processes. Thermal cycling alone did not change significantly the adhesion performance of any of the substrates studied. Pressure cooker test was detrimental to adhesion performance of oxide coated Cu substrates. Nevertheless, the residual interfacial bond strengths were consistently much higher for the black oxide coated substrates than the bare Cu surface. Significant delamination occurred between the bare Cu and the moulding compound after the moisture sensitivity test followed by thermal shock, whereas there was virtually no delamination on the black oxide coated samples under the same ageing condition, confirming the higher reliability of interfacial adhesion performance for the latter.