Maskless regrowth of GaN for trenched devices by MOCVD

Abstract

Blanket regrowth studies were performed on GaN trenches with varying widths and optimized for two types of devices—those that required the profile of the trench to be maintained and those that required the complete filling of trenches, i.e., a planar surface after regrowth. Low temperature Al0.22Ga0.78N growth was optimized and used as the marker layer for SEM. GaN deposition at a medium temperature of 950 °C and using N2 as carrier gas resulted primarily in growth on the (0001) plane, while the growth on the sidewalls was governed by the formation of slow growing semi-polar planes. This gave a conformal profile to the regrown GaN—useful for regrown GaN interlayer based vertical trench MOSFETs. In contrast, high temperature (1150 °C) growth in H2 resulted in high lateral growth rates. The planar surface was achieved under these conditions—a very promising result for CAVET-type devices.