Abstract
Smart MEMS devices such as pressure, mass flow and yaw rate sensors are presented in detail. One common point of this range of devices is their fabrication technology regarding anisotropic etching. This paper is first meant to give a short review upon the applications processed by using wet chemical etching in KOH-solutions. Furthermore, we will discuss about the impact of material and process related defects in the silicon crystal and on the anisotropic etching behavior.
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