<title>Focused ion beam: moving toward nanobiotechnology</title>

Abstract

ABSTRACT A new technique of Focused Ion Beam (FIB) microscopy/nanomachining is proposed. Ultrahigh resolutionthreedimensional tomography can be performed on whole cell, without preparation. Very fast imaging times(minutes) allow quasi realtime microscopy. FIB is a source of ions which can be precisely oriented and focused onthe sample. The resolution can be as low as 15 nm. Higher currents produce cutting and attaching operationsof very high precision where at the same time the resulting secondary ions and electrons again provide follow upsample in1agng.It will be shown that FIB tomography provides: - threedimensional imaging at ultrahigh resolution for biological samples almost in real time, where no specificpreparation procedures are required; - biornachining/nanoengineering of cells and of their compartments,both integrated in the same machine.Keywords: Focused Ion Beam, nanobiotechnology, cell tomography, cell ultrastructure 1. INTRODUCTION Focused Ion Beam (FIB) technology is an extremely important tool in semiconductor device manufacturing. It isan invaluable tool for failure analysis and design work, and is very important for other functions such as TEMspecimen preparation, surface analysis and lithographic mask repair. Recently, focused ion beam milling hasbecome an important tool for magnetic head manufacturing for hard disks. Promising areas of research includefocused ion beam implantation and lithography.Focused Ion Beam (FIB) systems can be employed to make precision modifications to a variety of samples. Thesemodifications can be as simple as a single probe hole to metal, or as complex as a three-dimensional cross-sectionof a circuit. The key ability of FIB technology is its capability to localize the modification to only the arearequiring alteration.The FIB can drill holes through passivation and cut metal lines. It can also deposit metals and insulators. Thesecapabilities allow the FIB systems to be used for analysis of electrical and physical failures and test structures aswell as the repair of nearly-functional parts.