Abstract
Selective laser annealing system was developed to realize fabrications of low-temperature poly-Si thin-film transistors (TFTs) even for large substrate, while the conventional excimer laser annealing system has the limitation in substrate size due to the difficulty in obtaining uniform beam line. In this paper, this new system was applied to fabricate poly-Si TFTs, using two laser exposure methods such as the static exposure and the scan exposure. Grain size increased as the laser energy density increased, and TFTs with the field-effect mobility larger than 100 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> V <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> s <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> with the ON- OFF ratio of drain current of approximately 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> could be obtained. Furthermore, for the scan exposure, periodic grain structure was observed resulting from the lateral solidification. In this condition, variations of electrical properties of TFT could be reduced compared to the case of the static exposure.
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