Abstract
This paper deals with multilayer magnetic components for power electronics application and specifically for high frequency switching. New formulations based on nickel-zinc-copper spinel ferrites were developed for high power and high frequency applications. These ferrites can be sintered at low temperature (around 900°C) which makes them compatible with the LTCC (Low Temperature Co-fired Ceramics) technology. Metallic parts of silver or gold can be fully integrated inside the ferrite while guaranteeing the integrity of both the ferrite and the metal. To make inductors or transformers with the required properties, it is mandatory to have nonmagnetic parts between the turns of the winding. Then it is essential to find a dielectric material, which can be co-sintered both with the ferrite and the metal. We will present the solution we found to this problem and we will describe the results we obtained for a multilayer co-sintered transformer. We will see that these new components have good performance compared with the state of the art and are very promising for developing high density switching mode power supplies.
Highlights
Magnetic components integration is today a major concern in power electronics
We propose to make very low profile magnetic components incorporating the winding directly inside the ferrite core in order to maximize the thermal conduction
We observed very low losses, lower than the ones of the bulk ferrite. This was attributed to a finer microstructure as the grain size was 2 times smaller than the bulk ferrite
Summary
Magnetic components integration is today a major concern in power electronics. Size reduction of inductors and transformers is mandatory to increase the power density. In consequence new low losses magnetic materials with new integration techniques are required. Spinel ferrites are the best low losses magnetic materials. In power electronics, these devices are conventionally built by using copper or aluminum wires wound on a ferrite core made by sintering at high temperature (T > 1200◦C). Planar cores with copper winding integrated in PCB allow making low profile components but the thermal behavior is still a major drawback. We propose to make very low profile magnetic components incorporating the winding directly inside the ferrite core in order to maximize the thermal conduction
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