<i>J</i>-Integral Approach to Creep-Fatigue Crack Propagation in Lead-Free Solder under Various Loading Waveforms

Abstract

Crack propagation tests of lead-free solder were conducted at room temperature in air using center-notched plates under load-controlled conditions with three waveforms: triangular pp waveform having fast loading and unloading rates, cp-h waveform having a hold time under tension, and cc-h waveform having a hold time under tension and compression. The J integral was evaluated from load-displacement curves. For fatigue loading of pp waveform, the crack propagation rate was expressed as a power function of the fatigue J-integral range. The creep component due to the hold time greatly accelerated the crack propagation rate. The creep crack propagation rate was found to be a power function of the creep J integral range for each case of cp-h and cc-h waveforms. The creep crack propagation rate for cp-h waveform was higher than that for cc-h waveform. Displacement-controlled tests were also performed under four triangular strain waveforms: pp, cp, cc and pc. For the case of pp waveform, the crack propagation rate was also expressed as the same power function of the fatigue J integral range as in the case of load-controlled tests. The creep crack propagation rate was expressed as a power function of the creep J integral range for each case of cp, pc and cc waveforms. Microscopic observations were conducted to clarify micromechanisms of creep-fatigue crack propagation.