Creep–fatigue crack propagation in lead-free solder under cyclic loading with various waveforms

Abstract

Abstract Crack propagation tests of lead-free solder were conducted using center-notched plate specimens under cyclic tension–compression of three load waveforms: pp waveform having fast loading and unloading, cp-h waveform having a hold time under tension, and cc-h waveform having a hold time under tension and compression. In the case of fatigue loading, i.e. pp waveform, the path of crack propagation was macroscopically straight and perpendicular to the maximum principal stress direction, showing tensile-mode crack propagation. The introduction of the creep components by hold time in cc-h and cp-h waveforms promoted shear-mode crack propagation. For fatigue loading of pp wave, the crack propagation rate was expressed as a power function of the fatigue J integral and the relation was identical for load-controlled and displacement-controlled conditions. The creep component due to the hold time greatly accelerates the crack propagation rate when compared at the same values of the fatigue J integral or the total J integral (the sum of fatigue J and creep J integrals). The creep crack propagation rate was expressed as a power function of the creep J integral for each case of cp-h and cc-h waveforms. The crack propagation rate for cp-h waveform is higher than that for cc-h waveform. The predominant feature of fracture surfaces was striations for pp waveform and grain boundary fracture for cp-h waveform. Grain fragmentation was abundantly observed on the fracture surface made under cc-h waveform.