Abstract
Typical IC layouts are simple shapes such as rectangles and 45 degree triangles. However, the high-spatial-frequency components of the mask spectrum cut off by the low-pass pupil will result in the rounded images and pattern distortions. Although optical proximity correction (OPC) has been proposed to address this issue as a standard industry practice, there are no theoretically perfect corrections due to some physical or chemical limitations. Therefore, how to qualify the correction results has become a problem. In this paper, the lithography rule check (LRC) based OPC recipe qualification is proposed. By extracting and grouping the LRC databases, the point-to-point post-OPC comparison matrix is shown. Finally, this new methodology can be integrated into the regression flow. When changing to a new software version or different OPC flow, this new validation methodology can not only tell the differences, but also report if there are any OPC quality degradations.
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