Abstract
We report a rapid patterning method for interconnects fabrication combining the ink-jet printing of silver nanoparticles and laser sintering on the ceramic substrate. The optimal parameters of laser irradiation were found. As-fabricated interconnects on ceramic substrate possess a sheet resistance 0.38Ω/sq and have good adhesion to substrate. Also, the pulsed laser annealing of silver particles after drying on polyimide substrate was investigated, and optimal parameters of laser irradiation were found to form peeling-free structures. The conductivity of as-prepared lines reached about 20% of bulk silver.
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