Abstract
A new plasma flood gun (PFG) apparatus using a toroidal RF discharge has been developed producing very low energy electrons at high emission for wafer charge neutralization. The performance of the Toroidal PFG (TPFG) will be characterized and discussed under the typical implantation conditions in VIISta ion implanters. The charging performance is measured by using metal-oxide-semiconductor (MOS) capacitor antenna devices as well as the surface charge monitoring technique called surface photo voltage (SPV). The metal contamination performance of the TPFG surpasses that of the conventional cathode based PFG due to no presence of transition metals in the plasma cavity. The TPFG also provides process transparency for dose and uniformity performance. In addition, the mean time between maintenance (MTBM) has drastically increased as compared to the conventional filament PFG. The projected MTBM will exceed the filament PFG current lifetime without charging performance degradation
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