Abstract
This paper presents a low-cost transfer mould packaging concept for sensors, based on a direct-mold principle.The advantage of this method is that up to the molding step the whole process is compatible with standard lead-frame processing. The molding concept and package structures allow plastic sensor packaging with one or more environmental access paths to be created in a single molding step. As an application of the new packaging concept, a plastic sensor package with a single access path has been developed for commercial production. The performances of this new low cost package are satisfactory and reliability tests show good results. Furthermore, packaging of other types of sensors is in preparation.
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