Abstract
This paper presents a low-cost transfer mould packaging concept for sensors, based on a direct-mould principle. The advantage of this new packaging concept, which we call the open-window package, is that up to the moulding step the whole assembly process is compatible with the standard lead-frame processing. The open-window package concept allows plastic sensor packaging with one or more environmental access paths to be created in a single moulding step. As an application of this new packaging concept, a plastic sensor package with a single access path has been developed for commercial production. The performances of this new low-cost package are satisfactory and lifetime performances show promising results. Furthermore, packaging of other types of sensors is in preparation.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
