Abstract
Low-thermal expansion electrostatic chuck materials have been evaluated for use in the EUVL α-tool of ASML because of the requirements for overlay and critical dimensions. The material investigated showed clear capacitive Coulomb clamping behavior, giving a maximum pressure of 1.04 bar. In vacuum, the limitation to the maximum pressure is the spontaneous field emission of electrons across the gap between wafer and dielectric material. In dry air, the actual voltage over the air-filled gap limits the maximum pressure because of electrical breakdown (Paschen curve minimum). The humidity in normal air further decreases the pressures obtained. Model clamps and test set-ups were designed and manufactured by TNO TPD.
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