Abstract
In this work, an easy and low-temperature fabrication method of three-dimensional (3D) ceramic substrate was proposed. A 3DPC ceramic substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) ceramic substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC ceramic substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic substrate could satisfy with three dimension packaging and integration.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
