Abstract
A low-temperature bonding process for surface acoustic wave (SAW) components was developed in ambient air by the surface activated bonding (SAB) method. In this method, the assembly was achieved using not Au bumps but Au bumpless structures directly. The required bonding pressure was optimized. To compare this method with conventional thermocompression bonding and thermosonic bonding methods, die shear and electrical tests were performed to determine the mechanical and electrical properties, respectively. Under optimized parameters, the bonding feasibility of miniaturized SAW components was confirmed at 25–100 °C in ambient air with the proper signal output and a high bonding strength. Scanning electron microscopy and energy dispersive X-ray spectrometry observations showed that no intermetallic compound formed around the bond interfaces.
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