Abstract
Conventional hot pressure diffusion bonding (HPDB) could result in undesired thermal and mechanical damages on base materials due to the high bonding temperature and long time. It has been a challenge to fabricate a reliable joint at a low bonding temperature and short time. In the present study, a spark plasma sintering (SPS) technique was used to resolve this challenge, and the microstructure and mechanical properties of the IC10/GH536 joints were systematically investigated. The results indicated that the pulsed current facilitated the micro-voids closure during the plasma activated diffusion bonding (PADB). At a relatively low temperature and short time (900 °C/30 min), a high joint shear strength of 541 MPa was obtained using the direct PADB, which was 4.74 times that of the direct HPDB joint. Increasing the bonding temperature to 1000 °C, a large number of M23C6 carbides formed at the grain boundaries and the bonding interface, which were the weak spots of the joint. In addition, by introducing a Ni foil to the PADB, the bonding temperature can be reduced to 800 °C and a joint shear strength of 424 MPa was obtained.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call