Low temperature amorphous silicon carbide thin film formation process on aluminum surface using monomethylsilane gas and trichlorosilane gas

Abstract

The low-temperature chemical vapor deposition process of silicon carbide (SiC) on an aluminum surface was developed. In order to prepare the reactive substrate surface, a silicon interlayer containing silicon dimers at its surface was formed using trichlorosilane gas at 600°C. Next, the SiC thin film was formed at room temperature using monomethylsilane gas. Silicon, carbon and silicon-carbon bond in the obtained film were detected by various evaluations. The SiC film was amorphous and about 5-nm thick.