Low noise Al0.85Ga0.15As0.56Sb0.44 avalanche photodiodes on InP substrates

Abstract

We report on the demonstration of Al0.85Ga0.15As0.56Sb0.44 (hereafter, AlGaAsSb) avalanche photodiodes (APDs) with a 1000 nm-thick multiplication layer. Such a thick AlGaAsSb device was grown by a digital alloy technique to avoid phase separation. The current-voltage measurements under dark and illumination conditions were performed to determine gain for the AlGaAsSb APDs. The highest gain was ∼ 42, and the avalanche initiation occurred at 21.6 V. The breakdown voltage was found to be around −53 V. The measured dark current densities of bulk and surface components were 6.0 μA/cm2 and 0.23 μA/cm, respectively. These values are about two orders of magnitude lower than those for previously reported 1550 nm-thick AlAs0.56Sb0.44 APDs [Yi et al., Nat. Photonics 13, 683 (2019)]. Excess noise measurements showed that the AlGaAsSb APD has a low k of 0.01 (the ratio of electron and hole impact ionization coefficients) compared to Si APDs. The k of the 1000-nm AlGaAsSb APD is similar to that of the thick AlAsSb APDs (k ∼ 0.005) and 5–8 times lower than that of 170 nm-thick AlGaAsSb APDs (k ∼ 0.5–0.8). Increasing the thickness of the multiplication layer over 1000 nm can also reduce k further since the difference between electron and hole impact ionization coefficients becomes significant in this material system as the thickness of the multiplication layer increases. Therefore, this thick AlGaAsSb-based APD on an InP substrate shows the potential to be a high-performance multiplier that can be used with available short-wavelength infrared (SWIR) absorption layers for a SWIR APD.