Low formaldehyde emission particleboard panels realized through a new acrylic binder

Abstract

AbstractThe effectiveness of acrylic resins as low formaldehyde emission binders for particleboard production was explored. In particular, a multifunctional methacrylic monomer, ethoxylated bisphenol A dimethacrylate, classified as nonskin and eyes irritant, was selected and tested. In comparison panels realized with classic urea‐formaldehyde (UF) binder were also prepared. No significant differences were found through the morpholocigal analysis of samples prepared with the two different binders. Moreover, particleboard panels realized with the acrylic binder showed better mechanical properties and lower water absorption and thickness swelling in comparison with corresponding panels realized with the UF binders. Furthermore, the replacement of the UF with the acrylic binder did not affect thermal insulation properties of the panels. Formaldehyde release tests revealed that particleboard panels obtained by applying the acrylic binder can be classified as E1 following the European classification and even F**** following the stricter Japanese classification. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011